Content
YAMAHA YSi-SP 3D Solder Paste Inspection SPI
❙ Features
❙ Specification
YSi-SP | ||
---|---|---|
Applicable PCB |
L510×W460mm~L50×W50mm (single lane spec) *No dual lane specification available. |
|
Horizontal resolution (FOV size) |
1)25µm / 12.5µm (approx. 50×50mm) 2)20µm / 10µm (approx. 40×40mm) 3)15µm / 7.5µm (approx. 30×30mm) *All are standard selection type. |
|
Height resolution | 1µm | |
Inspection items | Solder paste printing quality (volume, height, area and misalignment) | |
Power supply | Single-phase AC 200V–230V ±10% | |
Air supply source | Airless specification | |
External dimension | L904×W1,080×H1,478 mm | |
Weight | Approx. 550 kg |
❙ Related keywords
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❙ Main keywords
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