Yamaha YS100 Pick and Place Machine

Products description

Thanks to a high precision single placement beam that carries eight independent Z-servo controlled heads, the YS100 provides a perfect balance between chip and IC shooting. It is available in two versions: one with a Flying Nozzle Change (FNC) head for when many nozzle changes are needed and high output is important, the other with a Super Fine (SF) head for use with a wider component range including QFPs, connectors and tall components.

With placement rates up to 19.6k components per hour, the YS100 is fast. Placement accuracy is 30 microns for ICs. It handles a wide range of components from 0.4x0.2 mm (01005) to large connectors (100x45 mm), fine-pitch and components up to 15 mm tall. The YS100 holds up to 126 tape feeding positions.

Main benefits
The standard YS100 comes with software and hardware features to improve product quality, increase production efficiency, shorten NPI and changeover times and reduces maintenance, including:
Intelligent electrical feeders
Z-Servo controlled placement heads for accurate stress-free component mounting
Automatic board width and thickness adjustment for fast changeover
Automatic nozzle cleaning station
Automatic temperature feedback to compensate for temperature variations
Fiducial recovery function that eliminates the need to remove and clean the PCB
Feeder indicators that facilitate easy setup and reduce feeder setup
Double board support system for reducing board transfer time
Tape cutters

High-speed mounting capacity handling
25,000CPH(0.14sec/CHIP Equivalent : optimum condition)
+/-50μm(CHIP),
+/-30μm(QFP)mounting 
absolute accuracy in full time operation
Handles a wide range of components from 0402 chips to W45xL100mm or less components and with long connectors
Capable of handling 15mm height components
Applicable to large size PCB(L510mm x W460mm)
Built-in tape cutter available as an option
Conformity with both Machinery directive and EMC directive

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