Product Features

1) High-speed, high-precision mounting

Operation of the mounting head and wafer camera has been optimized, eliminating all standby time loss of the mutual units. In addition, by equipping the head with a scan camera, component recognition following wafer picking is completed during movement and taking the shortest path to the mounting position becomes possible, creating an efficient operations cycle. Further, the number of nozzles on the mounting head has been increased from 4 to 10, drastically reducing of the number of head cycles needed per number of components to be mounted. Thanks to these features, the i-Cube10 (YRH10) achieves a high bare chip mounting speed of 10,800 CPH (when supplying wafers).

The wafer replacement time has also been shortened, and even multi-die products requiring frequent wafer replacement can be produced without reducing throughput.
This unit also aids in achieving high-quality production by effectively utilizing our recognition system for ball/bump components, refined through the development of our flip-chip bonders such as the YSB55w.

Additionally, the rigidity of the frame was extensively reviewed. A high-rigidity conveyor was adopted to reduce its dynamic vibration during head operation and optimization of axis control parameters, a heat compensation feature and more achieve and maintain the unit’s high mounting accuracy of ±15 μm (μ+3σ).

2) High versatility

Since various types of components such as surface mount devices and wafer components can be mounted with the i-Cube10 (YRH10), a single unit can be used for mounting operations instead of having to divide tasks among multiple devices as was required before. This reduces costs and installation space.

The unit is also equipped with a variety of functions facilitating its high versatility, such as a non-stop wafer feed unit that can set up to 10 wafers, compatibility with PCBs up to L330 mm × W250 mm in size, automatic tool replacement, and a dual push-up unit.

In addition, the i-Cube10 (YRH10) is also compatible with the auto-loading feeder Yamaha surface mounters are known for, and can always supply tape reel components without stopping production or requiring supply timing selection.

3) Easy operation

The wafer pickup condition setup utility can visually set conditions for wafers, making the task require little to no skill and further supporting operator work efficiency.
In addition, the i-Cube10 (YRH10) is packed with user-friendly features, such as a newly developed user interface with improved usability and a feeder load capacity twice that of previous models.